VT07 SERIESVitrified Bond Blades
Suitable for a variety of applications from processing of difficult-to-cut workpieces to edge trimming of silicon wafers
- Vitrified bond
Applications: Si3N4, Crystal, Sapphire, etc
This bond series employs a vitrified bond that has been difficult to manufacture into thin blades so far. These blades can process with an acute degree of straightness and dimensional accuracy for high-load processing by using the excellent rigidity and cutting ability of the vitrified bond. As a result, VT07 realizes quality processing for difficult-to-cut materials. Thanks to the enhanced bond line-up, this bond series also realizes processing in various fields, such as edge trimming of silicon wafers.
- Able to process with a high degree of straightness and dimensional accuracy for high-load processing.
- Realizes high quality processing for hard ceramics and sapphire.
- Realizes high quality edge trimming.
Bond Line-up
Uses of each bond
| Bond name | Major applications | |
|---|---|---|
| VT07 | VC100 | For processing under high load or of hard-to-process materials (e.g., sapphire, silicon or deep groove processing) |
| VC200 | For edge trimming (silicon) |
Supported range of each bond
Experimental Data
Sapphire Processing
Compared to the existing blade, the VT07 blade can achieve a higher grade of processing for sapphire, which has an extremely high hardness.
| Workpiece | Sapphire 0.7 mmt |
| Blade | VT07-SD400-VC100-150 G1A851 SDC240R13B01 |
| Spindle revolution | 15,000 min-1 |
| Size | 56 x 0.3 x 40 mm |
Edge trimming of silicon wafers
The wafer edge trimmed by the VT07 blade (VC200 bond) has the same quality realized by the resin blade processing.
| Workpiece | Si |
| Blade | VT07-SD2000-VC200-100 B1A801 SD2000N100M42 P1A862 SD1200N100BR16 |
| Blade size | 58 x 1 x 40 mm |
| Feed rate | 5 degree/s |
| Depth | 0.5 mm into Si wafer |
| Spindle revolution | Vitrified bond 20,000 min-1 Resin/Metal bond 30,000 min-1 |
Specification
Cautions during usage
Note the below points on its characteristics when using the vitrified bond.
- Since the VT07 Series is nonconductive, contact setup (conductive type) cannot be used.
- Since there is a danger of blade breakage when using the VT07 Series at high rpm, use at the specified rpm.
- When using the VT07 Series on a machine with the standard BBD (Blade Breakage Detector Unit) the settings must be changed since there is a possibility of incorrect detection.
- Since there is a fear of blade breakage, do not conduct the chopper cut setup (CCS) before dressing.
Note: For details, contact your DISCO sales representative.
| O.D.（mm） | VT07 Max. spindle rotation（min-1） |
|---|---|
| 50.0-63.4 | 20,000 |
| 63.5-88.3 | 13,000 |
| 88.4-117.0 | 10,000 |
VT07 SERIESVitrified Bond Blades
Contact
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.
- USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
- DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
- FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
- DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
- Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
- READ the operation manual of the cutting/grinding equipment before use.
- DO NOT USE the precision tooling with modified or customized equipment.
- DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
- DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
- Always USE water or coolant to prevent precision tooling damage.