Applications: Chip LED board, Various types of semiconductor packages, etc
The ZHDG series developed for dicing various substrates adopts a larger grit size compared to the hub blades for semiconductor wafers. Also, the abundant concentration lineup meets a number of different customer requests.
Workpiece | Dresser board |
Depth | 0.5 mm (Half cut) |
Feed speed | 30 mm/s |
Spindle revolution | 30,000 min-1 |
Grit size | #700 |
Workpiece | Resin substrate with electrodes |
Depth | 1.5 mm (Full cut) |
Feed speed | 50 mm/s |
Spindle revolution | 30,000 min-1 |
Grit size | #700 |
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.