Applications: Various types of semiconductor packages, Green ceramics, Hard and brittle material, etc
The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types. A wide range of workpieces from processing of hard and brittle materials to dicing of each type of semiconductor package can be achieved.
During dicing, concentration affects both the speed of blade wear and the size of chipping. By selecting precisely a concentration* that is appropriate to the application, both wear speed and process quality can be made more stable and consistent.
*Concentration refers to the percentage of diamond grit in the abrasive portion of the
For example, a concentration level of 100 indicates 25 % diamond grit by volume.
In contrast to previous blades, which offered 2 concentration levels, standard and low level, the Z05 Series offers up to 6 concentration levels in a range that is both wider (includes lower levels than previously offered) and more finely divided.
Compared to previous products, it can sustain a stable edge because the change in shape of the blade tip is controlled.
Using the Z05 Series can result in reduced electrode and resin burring.
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.