Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for processing newly developed oxide wafers. It is capable of continuously processing oxide wafers, which has been difficult thus far, with a high level of stability. In addition, greater processing stability can be expected in the DBG processing of Lithium Tantalite wafers.
Workpiece | LiTaO3 Φ4” x 350 µmt |
Depth | 350 µm (full cut) |
Blade | ZHFX-SD2000-C1-50 DF NBC-ZH105L 27HEDF |
Cut direction
The above graph shows the measurement of current during the processing of a LiTaO3 wafers. With the ZHFX Series, compared to the existing series, as the number of lines increased, there is no rise in current, so stable processing can be verified.
Workpiece | LiTaO3 Φ4” x 350 µmt |
Depth | 150 µm (full cut) |
Blade | ZHFX-SD1700-C1-50 DF NBC-ZH106L 27HEDF |
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.