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News

2024

2024/09/17
DISCO Awarded 11th in “Best Workplaces in Asia 2024” Ranking
2024/09/03
Overseas Local Affiliate Established in India
2024/05/15
Newly Developed KABRA® Process that Achieves Large-Diameter Diamond Wafer Manufacturing

2023

2023/12/12
Newly Developed Die Separator for Hard Materials Such as SiC
2023/12/12
DAG811: Development of an Automatic Grinder with Improved Usability and a Space-saving Footprint
2023/12/12
Development of Three Types of New Dicing Blades and New Dry Polishing Wheel
2023/11/15
Osaka Branch Office Relocation with Completion of New Building
2023/10/23
Sales Release for a New ABC: Automatic Hubless Blade Replacement
2023/10/19
"Communication on Recommendations of TCFD"on the Environmental Management System page was updated.
2023/10/19
New Building Construction at Haneda R&D Center
2023/09/13
DISCO Awarded First in “Best Workplaces for Senior Employees 2023” Ranking
2023/07/05
Newly Established Mid-Process Research Center
2023/07/03
Development of a KABRA® Process Optimized for the Production of GaN Wafers
2023/06/29
Change of Director and Representative Executive Officer
2023/05/16
Observation and Measurement of the Processed Shape After Dicing Dicing Saws Equipped with a “3D Profiler” to be Shipped from May
2023/04/20
Representative Executive Officer Reassignment
2023/04/20
(Q&A section added on April 20) DISCO to Newly Introduce a Commitment Allowance System and Provide 100,000 yen per Month to Those who Apply
2023/04/13
DISCO to Newly Introduce a Commitment Allowance System and Provide 100,000 yen per Month to Those who Apply
2023/03/31
Sales Release for DFD6342:A Fully Automatic Dicing Saw That Supports Φ8-inch Wafers

2022

2021

2021/09/07
Be Cautious of Spam and Fraudulent Emails Pretending to be DISCO or a DISCO Employee
2021/08/06
Completion of Construction at Kuwabata Plant, Hiroshima Works (Zone D, Building A) Building A Expansion Completed
2021/06/29
Notice Regarding Change of Executives
2021/03/31
DISCO receives Intel corporation PQS award
2021/03/11
Exhibition at SEMICON CHINA (Mar.17-19)
2021/02/17
DISCO Awarded Third in “Best Workplaces in 2021”
2021/01/06
Completion of New Building Construction at Nagano Works Chino Plant

2020

2020/12/15
Exhibition at SEMICON JAPAN VIRTUAL (Dec.14-17)
2020/12/03
Development of DFG8020 and DFG8030 to support diversified package grinding needs Introducing two models to the market simultaneously
2020/11/30
Newly Developed Die Inspection Unit DIS100
Achieves Fully Automatic Quality Management After Dicing
2020/10/12
Exhibition at China International Import Expo（Nov. 5-10）
2020/10/12
Exhibition at IC China（Oct. 14-16）
2020/09/15
Exhibition at SEMICON Taiwan 2020 (Sep. 23-25)
2020/09/09
Certified as a 2020 Top 10 Great Place to Work in Taiwan
2020/07/03
Exhibition at VIRTUAL SEMICON West 2020 (July 20-23)
2020/06/26
Exhibition at SEMICON China 2020 (June 27-29)
2020/04/02
DISCO Laser Saw Shipments Exceed 2,000
2020/03/06
DISCO Receives Intel Corporation SCQI Award
2020/01/10
Exhibition at NEPCON JAPAN (Jan. 15-17)

2019

2019/12/10
Cluster System "MUSUBI" with Newly Developed Transfer System and Three Compatible Equipment Models Added to Product Lineup
2019/12/02
Improved Productivity and Reliability for Thin Memory Chips
Development of DDS2320, Die Separator with Dual Processing Stage
2019/11/21
The website regarding SEMICON Japan 2019 has been released
2019/11/12
Newly Developed DAD3351, Semi-Automatic Dicing Saw for ∅200 mm
Completion of Model Change for All Semi-Automatic Dicing Saws
2019/11/05
Exhibition at SEMICON Europa 2019 (Nov.12-15)
2019/06/25
Notice Regarding Change of Executives
2019/06/05
Relocation of California, USA Office.
2019/04/24
Decision to Construct a New Building at Nagano Works Chino Plant
2019/04/24
Exhibition at Laser World of PHOTONICS (June 24-27)
2019/04/24
Exhibition at PSECE (May 30-June 1)
2019/04/24
Exhibition at SEMICON Southeast Asia 2019 (May 7-9)
2019/03/25
DISCO has developed and published the JSA standards and specification, “Employee Satisfaction Standards JSA-S1001” for the first time as an individual company
2019/03/08
DISCO Corporation Receives Intel Corporation’s Prestigious Supplier Continuous Quality Improvement Award
2019/03/05
Exhibition at SEMICON China 2019 (Mar. 20-22)
2019/01/31
Completion of Building Construction at Kuwabata Plant (Zone C, A-Building)

2018

2018/12/12
Development of a System for Monitoring and Control of Precision Processing Equipment using a Smartphone or Other Device
2018/12/07
Ductless Drainless Dicing Saw through Installation of a Deionized Water Recycling Unit
2018/12/07
Model Change for All Four Semi-Automatic Dicing Saw Models
2018/12/07
Parallel Process Transferring System Ver. 2 Developed to Promote Post-Process Automation
2018/12/05
DFG8640, Fully Automatic Grinder Compatible with ø8-inch wafers, achieves high precision processing of difficult-to-grind materials
2018/12/04
Exhibition at 48th NEPCON JAPAN (Jan. 16-18)
2018/12/04
Exhibition at SEMICON Korea 2019 (Jan. 23-25)
2018/12/03
Improved Process Adaptability Development of DFD6363, Fully-Automatic Blade Dicing Saw for Φ300 mm Wafers
2018/11/20
The website regarding SEMICON Japan 2018 has been released
2018/10/29
Exhibition at SEMICON Europa 2018 (Nov. 13-16)
2018/08/28
Exhibition at productronica India (Sep. 26-28)
2018/08/15
Exhibition at SEMICON Taiwan 2018 (Sep. 5-7)
2018/06/25
Exhibition at SEMICON West 2018 (July 10-12)
2018/04/16
Notification of Subsidiary Transfer (Transfer of Shares)
2018/04/13
Exhibition at SEMICON Southeast Asia 2018 (May 22-24)
2018/04/01
Operations Started at Nagano Works Chino Plant
2018/03/08
DISCO Corporation Receives Intel's Prestigious Supplier Continuous Quality Improvement Award
2018/02/27
Exhibition at SEMICON China 2018 (Mar. 14-16)
2018/01/30
Exhibition at SEMICON Korea 2018 (Jan. 31 - Feb. 2)
2018/01/25
New Kyushu Branch Building Construction Completion and Relocation
2018/01/12
Exhibition at 47th NEPCON JAPAN (Jan. 17-19)
2018/01/09
DAL7440 KABRA® laser saw developed

2017

2017/12/11
KABRA!zen Developed: Full-Automatization of KABRA Laser Slicing Technology
2017/12/07
Newly Developed Fully Automatic Expander DFX2400 which Supports ø300 mm Wafers and Improves Separation Performance of Small Die Devices
2017/12/06
DFL7362: Stealth Dicing Laser Saw which Achieves Higher Throughput
2017/11/30
The website regarding SEMICON Japan 2017 has been released
2017/11/29
DFD6561: Newly Developed Small-Footprint, Fully-Automatic Dicing Saw which Supports ø300 mm Wafers
2017/11/28
Two Types of New Precision Processing Tools which Support Thinning for Advanced Semiconductor Devices
2017/11/10
Impact on DISCO's Products from Improper Conduct by Kobe Steel, Ltd.
2017/10/25
Decision for Further Expansion of Kuwabata Plant in Order to Enhance Production System of Precision Processing Tools
2017/09/13
KABRA process website updated.
2017/07/31
Establishment of Nagano Works Chino Plant
2017/07/18
Exhibition at IC China 2017 (Oct. 25-27)
2017/07/18
Exhibition at SEMICON Taiwan 2017 (Sep. 13-15)
2017/06/22
Exhibition at SEMICON West 2017 (July. 11-13)
2017/05/24
Notice for Change in Role of Managing Director
2017/03/23
Exhibition at FINE CHEMICALS JAPAN (Apr. 19-21)
2017/03/23
Exhibition at SEMICON Southeast Asia 2017 (Apr. 25-27)
2017/03/02
Relocation and Reconstruction of Kyushu Branch Office from March 3.
2017/02/22
Exhibition at SEMICON China 2017 (Mar. 14-16)
2017/02/02
DISCO Develops Hub Blades with High Quality-Standards: Sales of “ZH05 Prime Grade” to Be Officially Expanded
2017/01/23
Dedicated Facility for Equipment Operation Training Established in Taiwan Affiliate Office
2017/01/12
Exhibition at SEMICON Korea 2017 (Feb. 8-10)

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