DAD3360Automatic Dicing Saw

Note: This equipment has been discontinued. (Click here for information about spare parts.)

Φ300 mm manual dicer to meet a variety of needs

Φ300 mm
Single spindle

Exceptional processing flexibility

While offering an even more compact footprint than the existing DAD3350, workpieces of sizes up to Φ300 mm are now supported. Furthermore, a high output 1.8 kW spindle is now available as a standard option. The DAD3360 can cut not only silicon wafers, but also products of a variety of sizes and materials, such as large package substrates, electronic parts including SAW filters, and more.

A wide selection of options

Like its predecessors, the DAD3360 has a wide selection of options available to improve processing quality, to reduce running cost, and to improve its ability to process hard-to-cut materials.

High throughput and high stability processing

Stable processing is maintained due to the use of a bridge-type frame structure, which is highly effective at suppressing thermal expansion and vibrations, to provide the forward support for the spindle. Additionally, this allows the movement speed of each axis to be increased to provide high processing throughput.

User friendliness

An LCD touch panel with a GUI (graphical user interface) is included. Processing conditions, equipment status, and more is all presented visually. Operating the equipment is simple and needs nothing more than a simple touch of the icons on the interface.
In addition, XIS mode (Extended Interface System mode) which is a feature of the DFD6000 series is included as a standard option. Commonly used features such as light level adjustment, focus adjustment, and screen movement are all gathered on one screen providing a boost to efficiency.

Principal options

Measurement alignment

Aligns the substrate using multiple alignment points to allow for high precision even when processing substrates made of materials such as resin which have irregular expansion and contraction

2.2 kW spindle

A high torque and high rigidity 2.2 kW spindle can be selected as an option which offers a maximum Φ5-inch blade size and makes processing applications which require a heavy load on the blade possible. This includes processing of fused quartz, ceramics and other hard to cut materials, processing workpieces with a thickness of more than 3 mm, and grooving with a thick blade.

Multiple workpiece mounting

Multi-wafer support gives the DAD3360 the ability to process multiple package substrates on one tape frame (supports a maximum of 16 wafers)

Successor equipment

DAD3361

Specifications

Specification		Unit	1.8 kW	2.2 kW
Max. workpiece size		mm	Φ300 (250 mm × 250 mm user-specified specification)
X-axis	Cutting range	mm	310
X-axis	Cutting speed	mm/s	0.1 ～ 1,000
Y-axis	Cutting range	mm	310
	Index step	mm	0.0001
	Index positioning accuracy	mm	0.002/310 (Single error) 0.002/5
Z-axis	Max. stroke	mm	32.2	31.4
	Moving resolution	mm	0.00005
	Repeatability accuracy	mm	0.001
θ-axis	Max. rotating angle	deg	320
Spindle	Rated torque	N・m	0.29	0.70
Spindle	Rotation speed range	min^‐1	6,000 ～ 60,000	3,000 ～ 30,000
Equipment dimensions(W×D×H)		mm	880 × 1,000 × 1,800
Equipment weight		kg	Approx. 1,100

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

Product Lineup



Machine type
Spindle
C/T
Machine dimentions（W × D × H）
Machine weight（kg）


DAD324	DAD3221	DAD3231	DAD3241	DAD3350	DAD3351	DAD3361	DAD3431	DAD3651	DAD3660	DAD3661
Automatic	Automatic	Automatic	Automatic	Automatic	Automatic	Automatic	Automatic	Automatic	Automatic	Automatic
1	1	1	1	1	1	1	1	2	2	2
1	1	1	1	1	1	1	1	1	1	1
490 × 870 × 1,670	490 × 870 × 1,670	650 × 950 × 1,670	650 × 950 × 1,670	900 × 1,050 × 1,800	880 × 1000 × 1,800	880 × 1,000 × 1,800	730 × 900 × 1,670	790 × 790 × 1,800	1,350 × 1,200 × 1,890	1,350 × 1,200 × 1,800
420	420	550	550	1,200	1,100	1,100	600	1,040	1,500	1,550